Сайт использует cookie и счётчики посещений для работы и статистики. Политика конфиденциальности
Найдено: 60+
1 Scope This part of IEC 62047 specifies test methods for evaluating the durability of MEMS piezoelectric thin film materials under the environmental stress of temperature and humidity and under mech…
1 Scope This part of IEC 62047 specifies the requirements and testing method to measure the bending strength of microstructures which are fabricated by micromachining technology used in silicon-based…
What is BS IEC 62047-33 - MEMS piezoresistive pressure-sensitive device about ? BS IEC 62047-33 is the 33rd part of an international standard used for Semiconductor devices-microelectromechanical dev…
1 Scope This part of IEC 62047 specifies reliability test methods of electro-mechanical conversion characteristics of piezoelectric thin film on microcantilever, which is typical structure of micro s…
What is BS IEC 62047 ‑ 27 - Micro-chevron-tests (MCT) for semiconductor devices about? BS IEC 62047 is an international standard that discusses semiconductor devices including microelectromechanical…
What is BS IEC 62047 ‑ 31 - Micro-electromechanical systems (MEMS) materials about ? BS IEC 62047 ‑ 31 is the 31st part of an international standard used for semiconductor devices that specifies the…
What is BS IEC 62047 ‑ 35 - MEMS bending deformation testing about? In the recent trend toward ubiquitous sensor society and the world of internet of things, demand for softer electronic devices is q…
Overview IEC 62047-7:2011 is an international standard published by the International Electrotechnical Commission (IEC) that focuses on the evaluation and performance characterization of micro-electr…
Overview IEC 62047-50:2025 is the International Electrotechnical Commission standard that specifies test conditions and test methods for the performance of MEMS capacitive microphones. Applicable to…
Overview IEC 62047-48:2024 defines a standardized test method for determining solution concentration by optical absorption using a MEMS fluidic device. Part 48 of the IEC 62047 series specifies how t…
Overview IEC 62047-19:2013 is an international standard developed by the International Electrotechnical Commission (IEC) that defines the terminology, essential ratings and characteristics, and measu…
Overview IEC 62047-30:2017 specifies standardized measurement methods and a reporting schema for the electro‑mechanical conversion characteristics of MEMS piezoelectric thin film. The standard applie…
What is BS IEC 62047 ‑ 29 - Electromechanical relaxation test method for MEMS ? BS IEC 62047 is an international standard that discusses semiconductor devices including microelectromechanical devices…
What is BS IEC 62047-34- MEMS piezoresistive pressure-sensitive devices about? BS IEC 62047-34 is the thirty-fourth part of the Semiconductor devices and microelectromechanical devices that specifies…
1 Scope This part of IEC 62047 specifies a testing method for measuring device performance and failure strain under biaxial tensile deformation in stretchable MEMS materials. The typical examples of…
Overview IEC 62047-20:2014 is an international standard developed by the International Electrotechnical Commission (IEC) focusing on semiconductor micro-electromechanical systems (MEMS), specifically…
Overview - IEC 62047-27:2017 (micro-chevron-test for glass frit bonds) IEC 62047-27:2017 specifies a standardized method to assess bond strength of glass frit bonded structures using the micro-chevro…
Overview IEC 62047-10:2011 is an international standard developed by the International Electrotechnical Commission (IEC) that defines a micro-pillar compression test method specifically designed for…
Overview IEC 62047-40:2021 is an international standard developed by the International Electrotechnical Commission (IEC) focusing on micro-electromechanical (MEMS) inertial shock switches. Specifical…
Overview IEC 62047-31:2019 specifies a standardized four-point bending test method to measure the interfacial adhesion energy (critical energy release rate) of the weakest interface in layered MEMS m…
What is BS IEC 62047 ‑ 30 - MEMS piezoelectric thin film about ? BS IEC 62047 is an international standard that discusses semiconductor devices including microelectromechanical devices. The main aim…
Overview IEC 62047-49:2025 is an international standard developed by the International Electrotechnical Commission (IEC) focusing on the reliability testing of piezoelectric micro-electromechanical s…
Overview IEC 62047-5:2011 establishes international definitions, terminology, symbols, and test methods for evaluating and determining essential ratings and characteristic parameters of RF MEMS (Radi…
Overview IEC 62047-35:2019 defines the standardized test method for evaluating the electrical characteristics of flexible micro-electromechanical devices (MEMS) under bending deformation. Developed b…
Overview - IEC 62047-42:2022 (piezoelectric MEMS cantilever) IEC 62047-42:2022 specifies standardized measurement methods for the electro‑mechanical conversion characteristics of piezoelectric thin f…
Overview IEC 62047-45:2025 defines an in‑situ, on‑chip measurement method for the impact resistance of nanostructures fabricated by silicon‑based micromachining for MEMS (micro‑electromechanical syst…
Overview IEC 62047-46:2025 defines an in‑situ tensile strength measurement method for silicon-based MEMS membranes with nanoscale thickness. The standard covers membranes fabricated by micromachining…
Overview IEC 62047-52:2026 provides a standardized biaxial tensile testing method for evaluating the mechanical performance and failure strain of stretchable micro-electromechanical systems (MEMS) ma…
Overview IEC 62047-47:2024 specifies an in‑situ measurement method for bending strength of microstructures fabricated by micromachining technology in silicon‑based MEMS. The standard defines requirem…
Overview IEC 62047-14:2012 is an international standard published by the International Electrotechnical Commission (IEC) focusing on semiconductor devices-specifically micro-electromechanical systems…
Overview IEC 62047-13:2012 is an international standard published by the International Electrotechnical Commission (IEC) that defines standardized test methods for measuring the adhesive strength of…
Overview IEC 62047-18:2013 is an international standard published by the International Electrotechnical Commission (IEC) that specifies bend testing methods for thin film materials used in micro-elec…
IEC 62047-26:2016 Overview IEC 62047-26:2016 is an international standard published by the International Electrotechnical Commission (IEC) that focuses on semiconductor devices and micro-electromecha…
Overview IEC 62047-4:2008, titled "Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS," is an international standard published by the International Elect…
Overview IEC 62047-33:2019 - "Semiconductor devices - Micro‑electromechanical devices - Part 33: MEMS piezoresistive pressure‑sensitive device" - specifies terms, essential ratings and characteristic…
Overview IEC 62047-25:2016 is an international standard published by the International Electrotechnical Commission (IEC), focused on semiconductor devices and, specifically, micro-electromechanical s…
Overview IEC 62047-3:2006 is an international standard published by the International Electrotechnical Commission (IEC) that specifies requirements for a standard test piece used in tensile testing o…
Overview IEC 62047-1:2016 is an international standard published by the International Electrotechnical Commission (IEC) that sets forth essential terms and definitions for micro-electromechanical dev…
What is BS IEC 62047 ‑ 32 - MEMS resonator testing about? MEMS resonators are small electromechanical structures that vibrate at high frequencies. They are used for timing references, signal filterin…
Overview The IEC 62047-9:2011 standard provides a comprehensive methodology for measuring wafer-to-wafer bonding strength specifically tailored for Micro-Electromechanical Systems (MEMS). This intern…
Overview IEC 62047-4:2026 is an international standard developed by the International Electrotechnical Commission (IEC) that provides generic specifications for micro-electromechanical systems (MEMS)…
1 Scope This part of IEC 62047 specifies the requirements and testing method to measure the impact resistance of nanostructures which are fabricated by micromachining technology used in silicon-based…
What is BS IEC 62047 ‑ 28 - Vibration-driven MEMS for energy harvesting devices ? BS IEC 62047 is an international standard that discusses semiconductor devices including microelectromechanical devic…
What is BS IEC 62047 ‑ 36 - Test methods for MEMS piezoelectric thin films about? BS IEC 62047 is an international standard that discusses semiconductor devices including microelectromechanical devic…
Overview IEC 62047-17:2015 is an international standard published by the International Electrotechnical Commission (IEC) specifically addressing semiconductor devices and micro-electromechanical syst…
Overview IEC 62047-36:2019 - "Semiconductor devices - Micro‑electromechanical devices - Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films" - defines stand…
Overview IEC 62047-43:2024 specifies a standardized test method for electrical characteristics after cyclic bending deformation of flexible micro‑electromechanical devices (flexible MEMS). The scope…
Overview IEC 62047-16:2015 is an international standard published by the International Electrotechnical Commission (IEC) that specifies standardized test methods to determine residual stresses in mic…
Overview IEC 62047-32:2019 is an international standard published by the International Electrotechnical Commission (IEC) that defines the test method for nonlinear vibration of MEMS resonators. This…
Overview IEC 62047-44:2024 - "Semiconductor devices – Micro‑electromechanical devices – Part 44" specifies terminology, sample requirements and test methods for dynamic performances of MEMS resonant…
