BS EN 60749-20-1:2009 PDF

Semiconductor devices. Mechanical and climatic test methods - Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

Открыть превью (PDF)Semiconductor devices. Mechanical and climatic test methods - Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

Название (английский):

BS EN 60749-20-1:2009

Semiconductor devices. Mechanical and climatic test methods - Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

Формат:

Электронный (PDF)

Дата публикации:

31 июля 2009 г.

ICS:

31.080.01

Технический комитет:

CENELEC

SKU:

BS EN 60749-20-1:2009