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Overview IEC 60749-25:2003 is an international standard published by the International Electrotechnical Commission (IEC) that specifies mechanical and climatic test methods for semiconductor devices.…
Overview IEC 60749-20-1:2019 is an IEC standard that defines standardized handling, packing, labelling and shipping procedures for surface-mount devices (SMDs) that are sensitive to the combined effe…
Overview IEC 60749-13:2018 is an international standard published by the International Electrotechnical Commission (IEC) that specifies mechanical and climatic test methods for semiconductor devices…
1 Scope This part of IEC 60749 provides a means for determining the strength and failure mode of a wire bonded to, and the corresponding interconnects on, a die or package bonding surface and can be…
Overview IEC 60749-12:2017 is an international standard published by the International Electrotechnical Commission (IEC) that specifies mechanical test methods for semiconductor devices, focusing on…
Overview IEC 60749-7:2011 is an international standard developed by the International Electrotechnical Commission (IEC) focusing on semiconductor devices. This standard defines the mechanical and cli…
Overview IEC 60749-44:2016 is an international standard issued by the International Electrotechnical Commission (IEC) that specifies test methods for evaluating the effects of neutron radiation on se…
Overview IEC 60749-30:2020 - "Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non‑hermetic surface mount devices prior to reliability testing" - defines a s…
Overview IEC 60749-28:2017 - "Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level" de…
Overview IEC 60749-8:2002 is an international standard published by the International Electrotechnical Commission (IEC) that specifies mechanical and climatic test methods focused on the sealing and…
1 Scope This part of IEC 60749 describes a test method that is used to determine the capability of power semiconductor modules to withstand thermal and mechanical stress resulting from cycling the po…
What is BS EN IEC 60749-12 - Variable frequency vibration of semiconductor devices about? BS EN IEC 60749 is an international standard on semiconductor devices. BS EN IEC 60749-12 is the 12th part in…
Overview IEC 60749-21:2011 is an international standard published by the International Electrotechnical Commission (IEC) that defines methods for testing the solderability of semiconductor device pac…
Overview IEC 60749-6:2017 is an international standard published by the International Electrotechnical Commission (IEC) that defines mechanical and climatic test methods for semiconductor devices, sp…
Overview IEC 60749-17:2019 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies test methods for evaluating the neutron irradiation effects on…
Overview IEC 60749-3:2017 - "Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination" defines a standardized non-destructive external visual inspection meth…
Overview IEC 60749-37:2022 - "Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer" - specifies a standardized board-level drop…
Overview IEC 60749-24:2004 is an international standard published by the International Electrotechnical Commission (IEC) that specifies mechanical and climatic test methods for semiconductor devices.…
Overview IEC 60749-37:2008 is an international standard published by the International Electrotechnical Commission (IEC) that defines a board level drop test method for surface-mount semiconductor de…
Overview IEC 60749-34:2010 is an essential international standard developed by the International Electrotechnical Commission (IEC) that specifies the power cycling test methods for semiconductor devi…
Overview IEC 60749-5:2017 specifies a steady‑state temperature and humidity bias life test for evaluating the reliability of non‑hermetic packaged solid‑state (semiconductor) devices in humid environ…
Overview IEC 60749-17:2003 is an international standard issued by the International Electrotechnical Commission (IEC) that defines mechanical and climatic test methods for semiconductor devices, focu…
Overview IEC 60749-22-1:2025 is a critical international standard from the International Electrotechnical Commission (IEC) detailing mechanical and climatic test methods for semiconductor devices, sp…
Overview IEC 60749-18:2002 is an international standard published by the International Electrotechnical Commission (IEC) that specifies test methods for evaluating the effects of ionizing radiation (…
Overview IEC 60749-34-1:2025 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies a power cycling test method for power semiconductor modules.…
Overview IEC 60749-20:2008 is an international standard developed by the International Electrotechnical Commission (IEC) focusing on semiconductor devices. Specifically, it addresses the mechanical a…
Overview IEC 60749-7:2025 - "Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases" defines a destructi…
Overview - IEC 60749-20:2020 (Resistance of plastic encapsulated SMDs to moisture and soldering heat) IEC 60749-20:2020 is the International Electrotechnical Commission standard that defines a destru…
Overview IEC 60749-9:2017 specifies methods to assess the permanence of marking on solid-state semiconductor devices. The standard is intended to verify that device markings remain legible after expo…
Overview IEC 60749-14:2003 is an international standard developed by the International Electrotechnical Commission (IEC) for testing the robustness and lead integrity of semiconductor device terminat…
Overview IEC 60749-18:2019 - "Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)" defines test procedures for characterizing packaged semiconducto…
What is BS EN IEC 60749 ‑ 15 about? BS EN IEC 60749 ‑ 15 is the 15th part of Semiconductor devices in multi-series. BS EN IEC 60749 ‑ 15 describes a test used to determine whether encapsulated solid…
Overview IEC 60749-24:2025 - "Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST" specifies an unbiased Highly Accelerated Stress…
Overview IEC 60749-31:2002 is an international standard published by the International Electrotechnical Commission (IEC) that specifies test methods for evaluating the flammability of plastic-encapsu…
Overview IEC 60749-15:2010 is an international standard published by the International Electrotechnical Commission (IEC) that specifies mechanical and climatic test methods to evaluate the resistance…
Overview IEC 60749-42:2014 is an international standard published by the International Electrotechnical Commission (IEC) that specifies mechanical and climatic test methods for semiconductor devices,…
Overview IEC 60749-5:2023 - "Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady‑state temperature humidity bias life test" specifies a destructive, steady‑state temperature…
Overview IEC 60749-26:2025 - Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) - defines a standardize…
Overview IEC 60749-1:2002 is an international standard published by the International Electrotechnical Commission (IEC) focusing on semiconductor devices. This standard provides the general provision…
Overview IEC 60749-4:2017 defines the Highly Accelerated Stress Test (HAST) - a damp-heat, steady-state test method used to evaluate the reliability of non-hermetic packaged semiconductor devices in…
Overview IEC 60749-10:2022 is an internationally recognized standard that outlines mechanical shock test methods for semiconductor devices and subassemblies. Issued by the International Electrotechni…
Overview IEC 60749-39:2006 is an international standard published by the International Electrotechnical Commission (IEC) focusing on semiconductor devices. Specifically, it addresses mechanical and c…
Overview IEC 60749-26:2018 is an international standard published by the International Electrotechnical Commission (IEC) that specifies test methods for evaluating the electrostatic discharge (ESD) s…
What is BS EN IEC 60749 ‑ 17 about? BS EN IEC 60749 ‑ 17 is the 17th part of an international standard that covers the attributes of semiconductor devices. This specifies the neutron irradiation test…
Overview IEC 60749-15:2020 - Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through‑hole mounted devices - defines a reproducible sold…
Overview IEC 60749-41:2020 is an international standard that defines standard reliability testing methods for non-volatile memory devices, specifically focusing on semiconductor devices. Published by…
Overview IEC 60749-29:2011 is an international standard published by the International Electrotechnical Commission (IEC) that defines mechanical and climatic test methods specifically focused on the…
Overview IEC 60749-39:2021 - "Semiconductor devices - Mechanical and climatic test methods - Part 39" defines standardized laboratory procedures for measuring moisture diffusivity and water solubilit…
