PD IEC TR 61760-3-1:2022 PDF

Surface mounting technology - Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method

Открыть превью (PDF)Surface mounting technology - Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method

Название (английский):

PD IEC TR 61760-3-1:2022

Surface mounting technology - Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method

Статус документа:

Действующий

Формат:

Электронный (PDF)

Дата публикации:

31 октября 2022 г.

ICS:

31.190

SKU:

PD IEC TR 61760-3-1:2022