IEC TR 62240-2:2018 PDF

Process management for avionics - Electronic components capability in operation - Part 2: Semiconductor microcircuit lifetime

Первая страница стандарта IEC TR 62240-2:2018

Открыть превью (PDF)

Название (английский):

IEC TR 62240-2:2018

Process management for avionics - Electronic components capability in operation - Part 2: Semiconductor microcircuit lifetime

Статус документа:: Действующий
Формат:: Электронный (PDF)
Количество страниц:: 28
Дата публикации:: 18 июня 2018 г.
Издание:: IEC TR 62240 edition 1 version 1
ICS:: 03.100.50

Язык документа:

ruen

Срок поставки:5 раб. дн. (перевод)

Цена:420 €

Описание (английский):

IEC TR 62240-2:2018(E) describes a process and a method for selecting digital semiconductor microcircuits by ensuring that their lifetime is compatible with the requirements of aerospace, defence and high performance (ADHP) applications (generally in connection with functional environments). Methods and guidelines are provided to assess the long term reliability of COTS semiconductor microcircuits in such applications; they mainly apply during the electronic design phase when selecting semiconductor microcircuits and assessing the application reliability. focuses on original equipment manufacturers (OEMs) using commercial off the shelf (COTS) semiconductor microcircuits for high performance, high reliability and long duration applications. This document supports OEMs in the preparation and maintenance of their semiconductor electronic component management plan (ECMP).

Технические детали

Технический комитет: TC 107 - Process management for avionics
SKU: IEC TR 62240-2:2018

Abstract

Overview

IEC TR 62240-2:2018 - "Process management for avionics – Electronic components capability in operation – Part 2: Semiconductor microcircuit lifetime" is a technical report that provides a structured process and practical method for assessing the lifetime of COTS semiconductor microcircuits used in aerospace, defence and high performance (ADHP) applications. The report targets OEMs and supports the preparation and maintenance of the Electronic Component Management Plan (ECMP) to ensure selected digital semiconductor microcircuits meet long‑term mission lifetime requirements.

Key topics and requirements

Scope and focus
- Applies mainly during electronic design and component selection.
- Emphasis on intrinsic wear‑out and lifetime for deep sub‑micron (DSM) devices (≤ 90 nm feature size).
- Packaging wear‑out and random failure mechanisms are explicitly out of scope.
Lifetime assessment process
- A stepwise process flow for lifetime assessment and COTS selection (see Figure 1 in the report).
- Inputs include OCM (original component manufacturer) data, operating/thermal mission profiles, and technological parameters.
Physics of Failure (PoF) based risk analysis
- Uses PoF and component family characteristics to identify likely failure and degradation mechanisms.
- Considers new failure modes arising from technology scaling (e.g., FinFET, FD‑SOI, new materials).
Acceleration models and lifetime calculation
- Guidance on using acceleration models to extrapolate life under mission conditions.
- Assessment paths when OCM lifetime data is unavailable or incomplete.
Compliance and mitigation
- Methods to determine lifetime compliance for the mission.
- Guidance on mitigation strategies and when to reconsider component choices.
Deliverables
- Template and content guidance for a final lifetime assessment report (Annex F).
Informative annexes
- Failure mechanisms (Annex A), mission profile examples (Annex B), risk mapping by device family (Annex C), BEOL/FEOL parameters (Annex D), and example acceleration models (Annex E).

Applications and users

Primary users: OEMs designing avionics and ADHP systems that integrate COTS semiconductor microcircuits.
Practical uses:
- Selecting semiconductor microcircuits with demonstrable mission lifetimes.
- Building or updating an ECMP and supplier/OCM data requirements.
- Performing PoF‑based risk assessments, lifetime calculations, and risk mitigation planning for long‑duration platforms (aircraft, defence systems, space/long‑life electronic equipment).

Related standards and guidance

IEC 62239‑1: supports ECMP creation/maintenance.
SAE ARP6338: guidance on assessment and mitigation of early wear‑out.
Notes in IEC TR 62240‑2: MIL‑HDBK‑217 and FIDES are referenced as less appropriate for DSM devices due to scaling‑related wear‑out effects.

Keywords: IEC TR 62240-2, semiconductor microcircuit lifetime, COTS, avionics, OEM, ECMP, lifetime assessment, physics of failure, DSM, reliability, lifetime calculation.

Overview

Key topics and requirements

Scope and focus
- Applies mainly during electronic design and component selection.
- Emphasis on intrinsic wear‑out and lifetime for deep sub‑micron (DSM) devices (≤ 90 nm feature size).
- Packaging wear‑out and random failure mechanisms are explicitly out of scope.
Lifetime assessment process
- A stepwise process flow for lifetime assessment and COTS selection (see Figure 1 in the report).
- Inputs include OCM (original component manufacturer) data, operating/thermal mission profiles, and technological parameters.
Physics of Failure (PoF) based risk analysis
- Uses PoF and component family characteristics to identify likely failure and degradation mechanisms.
- Considers new failure modes arising from technology scaling (e.g., FinFET, FD‑SOI, new materials).
Acceleration models and lifetime calculation
- Guidance on using acceleration models to extrapolate life under mission conditions.
- Assessment paths when OCM lifetime data is unavailable or incomplete.
Compliance and mitigation
- Methods to determine lifetime compliance for the mission.
- Guidance on mitigation strategies and when to reconsider component choices.
Deliverables
- Template and content guidance for a final lifetime assessment report (Annex F).
Informative annexes
- Failure mechanisms (Annex A), mission profile examples (Annex B), risk mapping by device family (Annex C), BEOL/FEOL parameters (Annex D), and example acceleration models (Annex E).

Applications and users

Primary users: OEMs designing avionics and ADHP systems that integrate COTS semiconductor microcircuits.
Practical uses:
- Selecting semiconductor microcircuits with demonstrable mission lifetimes.
- Building or updating an ECMP and supplier/OCM data requirements.
- Performing PoF‑based risk assessments, lifetime calculations, and risk mitigation planning for long‑duration platforms (aircraft, defence systems, space/long‑life electronic equipment).

Related standards and guidance

IEC 62239‑1: supports ECMP creation/maintenance.
SAE ARP6338: guidance on assessment and mitigation of early wear‑out.
Notes in IEC TR 62240‑2: MIL‑HDBK‑217 and FIDES are referenced as less appropriate for DSM devices due to scaling‑related wear‑out effects.

Keywords: IEC TR 62240-2, semiconductor microcircuit lifetime, COTS, avionics, OEM, ECMP, lifetime assessment, physics of failure, DSM, reliability, lifetime calculation.

IEC TR 62240-2:2018 PDF

Технические детали

Abstract

Overview

Key topics and requirements

Applications and users

Related standards and guidance

Похожие стандарты

Abstract

Overview

Key topics and requirements

Applications and users

Related standards and guidance

Похожие стандарты

Process management for avionics. Management plan - Preparation and maintenance of an electronic components ma…

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal le…

Electric vehicle conductive charging system - Part 23-1: DC electric vehicle supply equipment - Automated con…

Calibration of the prompt fission neutron logging tools

Fibre optic interconnecting devices and passive components - Fibre optic connector interfaces - Part 4: Type…

Medical electrical equipment - Part 2-91: Particular requirements for basic safety and essential performance…

Flexible displays - Part 6-42: Mechanical test methods - Flattening force measurement methods for rollable di…

Radiation protection instrumentation - Measurement of personal dose equivalents for X, gamma, neutron and bet…