IEC TR 61189-5-506:2019 PDF

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501

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IEC TR 61189-5-506:2019

Статус документа:: Действующий
Формат:: Электронный (PDF)
Количество страниц:: 23
Дата публикации:: 26 июня 2019 г.
Издание:: IEC TR 61189 edition 1 version 1
ICS:: 31.180

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Срок поставки:4 раб. дн. (перевод)

Цена:345 €

Описание (английский):

IEC TR 61189-5-506:2019(E) is an intercomparison supporting the development of IEC 61189-5-501 in relation to the SIR method. This document sets out to validate the introduction of a new 200-µm gap SIR pattern, and was benched marked against existing SIR gap patterns of 318 µm and 500 µm.

Технические детали

Технический комитет: TC 91 - Electronics assembly technology
SKU: IEC TR 61189-5-506:2019

Abstract

Overview

IEC TR 61189-5-506:2019 is a Technical Report from the IEC that documents an intercomparison study to support the development of IEC 61189-5-501. The report validates the introduction of a fine-pitch 200‑µm gap SIR (surface insulation resistance) pattern for evaluating solder flux residues. The 200‑µm pattern was bench‑marked against existing SIR gap patterns of 318 µm and 500 µm using centrally prepared test boards and a standardized test protocol across multiple laboratories.

Key topics and technical requirements

Purpose: validate a new fine‑pitch SIR pattern to better represent modern fine‑pitch assembly technology and to improve characterization of flux‑induced failure mechanisms.
Test structure: test boards included three gap patterns (200 µm, 318 µm, 500 µm), each duplicated for six patterns per board.
Intercomparison approach: seven laboratories in five countries participated; boards were fluxed centrally and tested using a defined protocol.
Test procedure elements (described in the report):
- Sample preparation and standardized flux loading (rosin flux specified in the protocol).
- Thermal conditioning and handling prior to testing.
- Placement in a humidity chamber to simulate condensing/high‑humidity environments (results include tests at elevated humidity/temperature).
- Periodic resistance measurements to determine SIR over time.
- Data analysis and evaluation comparing 200‑µm performance against 318 µm and 500 µm patterns.
Failure modes considered: sensitivity to electrochemical migration (ECM), corrosion, dendritic growth and other surface electrochemical failures at fine pitch.

Practical applications and who should use this standard

PCB and electronics reliability engineers assessing flux residue risk and long‑term insulation reliability.
Test laboratories performing SIR/ECM characterization and seeking a standardized, fine‑pitch test method.
Flux manufacturers and formulators validating residue behavior on modern, high‑density assemblies.
OEMs and contract manufacturers using fine‑pitch components (BGA, fine‑pitch connectors) who need representative reliability data.
Standards developers and qualification labs integrating updated SIR patterns into quality and acceptance criteria.

Benefits:

More representative SIR testing for contemporary fine‑pitch assemblies.
Harmonized test protocol enabling cross‑lab comparability.
Improved detection of ECM and corrosion risks at smaller electrode gaps.

Related Standards (if applicable)

IEC 61189-5-501 - the SIR method for solder fluxes (this TR supports its development).
The broader IEC 61189 series - test methods for electrical materials, printed boards and interconnection assemblies.

Keywords: IEC TR 61189-5-506:2019, SIR, surface insulation resistance, 200‑µm gap, fine‑pitch, solder flux, intercomparison, IEC 61189-5-501, electrochemical migration (ECM), test board.

Overview

Key topics and technical requirements

Purpose: validate a new fine‑pitch SIR pattern to better represent modern fine‑pitch assembly technology and to improve characterization of flux‑induced failure mechanisms.
Test structure: test boards included three gap patterns (200 µm, 318 µm, 500 µm), each duplicated for six patterns per board.
Intercomparison approach: seven laboratories in five countries participated; boards were fluxed centrally and tested using a defined protocol.
Test procedure elements (described in the report):
- Sample preparation and standardized flux loading (rosin flux specified in the protocol).
- Thermal conditioning and handling prior to testing.
- Placement in a humidity chamber to simulate condensing/high‑humidity environments (results include tests at elevated humidity/temperature).
- Periodic resistance measurements to determine SIR over time.
- Data analysis and evaluation comparing 200‑µm performance against 318 µm and 500 µm patterns.
Failure modes considered: sensitivity to electrochemical migration (ECM), corrosion, dendritic growth and other surface electrochemical failures at fine pitch.

Practical applications and who should use this standard

PCB and electronics reliability engineers assessing flux residue risk and long‑term insulation reliability.
Test laboratories performing SIR/ECM characterization and seeking a standardized, fine‑pitch test method.
Flux manufacturers and formulators validating residue behavior on modern, high‑density assemblies.
OEMs and contract manufacturers using fine‑pitch components (BGA, fine‑pitch connectors) who need representative reliability data.
Standards developers and qualification labs integrating updated SIR patterns into quality and acceptance criteria.

Benefits:

More representative SIR testing for contemporary fine‑pitch assemblies.
Harmonized test protocol enabling cross‑lab comparability.
Improved detection of ECM and corrosion risks at smaller electrode gaps.

Related Standards (if applicable)

IEC 61189-5-501 - the SIR method for solder fluxes (this TR supports its development).
The broader IEC 61189 series - test methods for electrical materials, printed boards and interconnection assemblies.

Keywords: IEC TR 61189-5-506:2019, SIR, surface insulation resistance, 200‑µm gap, fine‑pitch, solder flux, intercomparison, IEC 61189-5-501, electrochemical migration (ECM), test board.

IEC TR 61189-5-506:2019 PDF

Технические детали

Abstract

Overview

Key topics and technical requirements

Practical applications and who should use this standard

Related Standards (if applicable)

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Abstract

Overview

Key topics and technical requirements

Practical applications and who should use this standard

Related Standards (if applicable)

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