BS EN IEC 61249-2-51:2023 PDF
Materials for printed boards and other interconnecting structures - Reinforced base materials, clad and unclad. Base materials for integrated circuit card carrier tape, unclad
Открыть превью (PDF)Materials for printed boards and other interconnecting structures - Reinforced base materials, clad and unclad. Base materials for integrated circuit card carrier tape, uncladНазвание (английский):
BS EN IEC 61249-2-51:2023
Materials for printed boards and other interconnecting structures - Reinforced base materials, clad and unclad. Base materials for integrated circuit card carrier tape, unclad
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Дата публикации:
- 30 июня 2023 г.
- ICS:
- 29.035.10
- Технический комитет:
- CENELEC
- SKU:
- BS EN IEC 61249-2-51:2023
