BS EN IEC 61190-1-3:2018 PDF

Attachment materials for electronic assembly - Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

Открыть превью (PDF)Attachment materials for electronic assembly - Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

Название (английский):

BS EN IEC 61190-1-3:2018

Attachment materials for electronic assembly - Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

Статус документа:

Действующий

Формат:

Электронный (PDF)

Дата публикации:

31 марта 2018 г.

ICS:

31.190

Технический комитет:

CENELEC

SKU:

BS EN IEC 61190-1-3:2018