BS EN IEC 61189-3-302:2025 PDF

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

Открыть превью (PDF)Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

Название (английский):

BS EN IEC 61189-3-302:2025

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

Статус документа:

Действующий

Формат:

Электронный (PDF)

Дата публикации:

30 ноября 2025 г.

ICS:

31.180

Технический комитет:

CENELEC

SKU:

BS EN IEC 61189-3-302:2025