BS EN IEC 61189-2-501:2022 PDF

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Test methods for materials for interconnection structures. Measurement of resilience strength and resilience strength retention factor…

Открыть превью (PDF)Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Test methods for materials for interconnection structures. Measurement of resilience strength and resilience strength retention factor…

Название (английский):

BS EN IEC 61189-2-501:2022

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Test methods for materials for interconnection structures. Measurement of resilience strength and resilience strength retention factor…

Статус документа:

Действующий

Формат:

Электронный (PDF)

Дата публикации:

31 мая 2022 г.

ICS:

31.180

Технический комитет:

IEC

SKU:

BS EN IEC 61189-2-501:2022