BS EN IEC 61188-6-3:2025 PDF

Circuit boards and circuit board assemblies. Design and use - Land pattern design. Description of land pattern for through hole components (THT)

Открыть превью (PDF)Circuit boards and circuit board assemblies. Design and use - Land pattern design. Description of land pattern for through hole components (THT)

Название (английский):

BS EN IEC 61188-6-3:2025

Circuit boards and circuit board assemblies. Design and use - Land pattern design. Description of land pattern for through hole components (THT)

Статус документа:

Действующий

Формат:

Электронный (PDF)

Дата публикации:

28 февраля 2025 г.

ICS:

31.180

Технический комитет:

CENELEC

SKU:

BS EN IEC 61188-6-3:2025