BS EN 60191-6-21:2010 PDF

Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)

Открыть превью (PDF)Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)

Название (английский):

BS EN 60191-6-21:2010

Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)

Формат:

Электронный (PDF)

Дата публикации:

31 декабря 2010 г.

ICS:

25.040.40

Технический комитет:

CENELEC

SKU:

BS EN 60191-6-21:2010